Highlights
• India signs landmark semiconductor MoU with Intel and 3DGS
• Advanced Packaging Glass Core Substrate Manufacturing Facility to be set up in Odisha
• Project to come up in Bhubaneswar–Khurda region
• Intel to provide technology know-how and process expertise
• Major boost to India Semiconductor Mission and domestic chip ecosystem
• Expected to generate large-scale high-skilled employment opportunities
• Focus on advanced packaging glass core substrates and semiconductor technologies
• Odisha positioned as an emerging global semiconductor manufacturing hub
• Project to be implemented in phases over the next five to six years
New Delhi, May 29, 2026: India has taken another major step towards becoming a global semiconductor manufacturing hub with the signing of a landmark Memorandum of Understanding (MoU) between the Government of Odisha, Intel Corporation and US-based 3DGS Inc. to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha.
The MoU was signed in the presence of Union Minister for Electronics & IT Shri Ashwini Vaishnaw, Odisha Chief Minister Mohan Charan Majhi, Intel CEO Lip-Bu Tan and other senior officials. The proposed facility will be set up in the Bhubaneswar–Khurda region and is being described as one of the largest high-technology manufacturing investments in India.
The project aims to bring advanced substrate manufacturing technology to India and strengthen the country’s semiconductor ecosystem under the India Semiconductor Mission. The facility will focus on advanced packaging glass core substrates, high-density interconnect substrates and other semiconductor technologies.
Speaking at the event, Union Minister Ashwini Vaishnaw said that the investment reflects the growing trust of global semiconductor companies in India’s technology and manufacturing capabilities. He highlighted that companies like Applied Materials, Lam Research, Tokyo Electron, Merck Electronics and ASML are also increasing their engagement with India’s semiconductor sector.
The project will be implemented in multiple phases over the next five to six years. Intel will support the initiative with technology know-how and process expertise, while the Odisha government will facilitate infrastructure and policy support.
Officials said the manufacturing facility is expected to generate large-scale direct high-skilled employment along with significant indirect job opportunities across the broader electronics and technology supply chain.
The initiative is also expected to boost export-oriented manufacturing, strengthen India’s digital infrastructure capabilities and position Odisha as an emerging semiconductor manufacturing destination globally.
The agreement marks another important milestone in India’s push to become self-reliant in semiconductor manufacturing and advanced electronics production.
